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Industry News

CMMF2016
Keynote Speech
Date: Aug. 25, 2016
Venue: 6/F Narcissus Hall, Shenzhen Convention & Exhibition Center

Time
Topic & Speaker
08:30-08:50
Sign In
08:50-09:00
Opening Remark
Xinsheng Zhang, Vice Chairman and Secretary General,
China Institute of Communications
09:00-09:30
Innovative Solutions for Mobile Device Assembly
David D. Lu, Senior Director, Huawei Device R&D USA
09:30-10:10
Smart SMT Factory -- Our Smart Move to Industry 4.0
Cai Dahai, Software Product Manager,ASM Assmebly Systems Ltd.
10:10-10:50
Gore ® Portable Electronic Vents for Mobile Electronics
Bennie Zheng, Application Manager, W. L. Gore & Associates
10:50-11:30
Application of Automation in Mobile Phone Manufacturing
SD Peng, General Manager, Shenzhen Colibri Technologies Co., Ltd.
11:30-12:00
The Development Trend of China's Mobile Phone Market
Rick Li, Sino Market Research Ltd.
Fourum 1:Adhesive Dispensing Technology
Date: August 25, 2016
Venue: 6/F Narcissus Hall, Shenzhen Convention & Exhibition Center
Time
Lunch break
14:00-14:30
Study on the Problems of Mobile Phone Dispensing
Hongfa Yu, Director of DFX, ZTE
14:30-15:00
Advanced Dispensing Solution for Hand-held Devices
Eric Gu, Application Manager, Nordson ASYMTEK
15:00-15:30
The challenges and new trend of dispensing in smart phone manufacturing
lvan Li, General Manager, Shenzhen Axxon Automation Co.,Ltd
15:30-16:00
Cost Effective and Flexible Dispensing Solutions for Mobile Industry
Danny Liang, Senior Application Engineer, NORDSON EFD
16:00-16:30
New Challengesfor Precision Dispensing in Smartphone Assembly
Gao Yang, Section Chief, Mechatronics System Center, Shinwa co., Ltd.
Forum 2:Waterproof Technology
Date: August 25, 2016
Venue: 5/F Chrysanthemum Hall, Shenzhen Convention & Exhibition Center
Time
Lunch break
14:00-14:30
Waterproof Product Design Overview and Derivatives
Tim Wang, Product Marketing GM, MFOX CO, LTD
14:30-15:00
Waterproof Technology Trend of Smart Devices-Status of Japan Market and Waterproof Inspection
Pengxiang Li, Staff of a Section Market Development Section, HAMRON TEC CO.,LTD
15:00-15:30
Mobile Device Water/Life-Proofing
Abe Ghanbari, Chief Solutions Officer, Semblant
15:30-16:00
Waterproof materials solution for handheld device and peripheral
Stanley Hu, Electronics Materials PD Manager, Henkel
16:00-16:30
Favoered Functional Nano Anti-water Coating Technology
Lin Zhang, Expert in Nano Anti-water Technology, FavoredTech
Forum 3:Application of Industrial Robot/ Sip Technology
Date: August 25, 2016
Venue: 5/F Peony Hall, Shenzhen Convention & Exhibition Center
Time
Lunch break
14:00-14:30
Robotic automation challenge, opportunity and future in 3C industry.
Jason Chen, 3C Industry Manager, ABB Engineering (Shanghai) Ltd
14:30-15:00
Robotic Development & Applications
Jiapeng Dai, Senior VP, Automation Technology Committee GM, FOXCONN
15:00-15:30
Robot Solutions in the Field of Smart Phone Industry Chain°°
Lin Rui, Division Manager, Electronics, KUKA Robotics China Co.,Ltd.
15:30-16:00
Application of 3D Folded Package on Mobile Electronics Device
Wan Bin, CEO, HK KANA TECHNOLOGY CO., LTD.
Forum 4:Test and Detect
Date: August 25, 2016
Venue:Venue: 6/F Tulip Hall, Shenzhen Convention & Exhibition Center
Time
Lunch break
14:00-14:30
Destination of 5G
Hao Wu, ZTE
14:30-15:00
Redefining RF Test - The Way to Meet RF Test Challenges of 5G and IoT Era
Tingtign Yuan, RF System engineer, National Instruments
15:00-15:30
King, HW Director, Department of R&D Technology, OPPO
15:30-16:00
Profile of Chinese NAL(Network Access License) for 4G Wireless Terminals
Haotao Shen, Director of Marketing Department, South Institute of CAICT