高级总监 罗德威


With 23+ years' experience. Expertise in SMT, PCBA and PTH process, documentation, facility layout, SMT equipment selection, advanced chip packages, new leading-edge technology, process, material development. Experienced in DFM, DFT & DFX, single- and double-sided PCBA process, wave soldering, new product introduction, EMS outsourcing, cost reduction through process improvement and efficiency, New business solution development. New product and concept prototype introduction. RFID traceability application. Lead industrial consortium and external business collaboration. Strong leadership, coaching, learning, IPR and R&D capabilities with international background and East-meets-West culture & multi-language capability. Provide keynote presentation and speech in conferences, seminar and training courses.