罗德威 诺基亚全球技术经理


with 18+ years' experience. Expertise in SMT, PCBA and PTH process, documentation, facility layout, SMT equipment selection, advanced chip packages, new process development. Experienced in DFM, DFT, single- and double-sided PCBA process, wave soldering, new product introduction, PCBA outsourcing, cost reduction through process improvement and efficiency, IPC, Bellcore, ISO-9000/14000 and other standards. B.A.Sc. and M.A.Sc. in engineering. Strong leadership, coaching, learning and R&D capabilities with international background. •Fluxless soldering in wave soldering equipment by using forming gas, a technical paper is published under name of Teknor, which was presented at NEPCON West and SMTA annual conference, USA (1997). • D.W. Lu and K. Jankowski, Gif oxidation of some quinolizines obtained from the imino Diels-Alder reaction, Spectroscopy, 11 (1993) 59-78, Elsevier Science Publishers B.V., Amsterdam, Netherlands.