三星电子 机械电子与制造技术中心 电子组装与连接实验室 基础技术团队 高级工程师/Ph.D. TaeSang Park


received the B.Eng, the M.S. and Ph.D. degrees in mechanical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea in 1996,1998 and 2004, respectively. Since 2004, he has been with Samsung Electronics, Korea, as a senior Engineer. His research interests are focused on reliability design and prediction for electronic packages in mobile products. His experience includes engineering works to evaluate various failure mechanisms for engineering problems in electronic packaging reliability field. Currently, he is interested in developing next generation packaging technology and reliability evalution methods.