Workshop: Advanced Packaging of High Brightness LED for
Solid State Lighting

Date: Nov. 16, 2010          Venue: Shenzhen China

Lecturer: Dr. Ricky Lee, HKUST LED-FPD Technology R&D Center

Introduction:

With the advancement of materials and packaging technologies, the illumination performance of light-emitting diode (LED) has been greatly improved in the past decade. In recent years high power white LEDs have reached efficiencies high enough to kick off serious discussion on using LEDs for solid state lighting (SSL). The performance of high brightness LED (HB-LED) has continued to grow from about 20 Lumens/Watt to over 150 Lumens/Watt. SSL has major advantages such as energy saving, environmental friendliness, and long operational life. LED Packaging is the major enabling technology to achieve these merits. This short course will review the technology trends of lighting sources and introduce the features of LED. Technical issues in packaging LED components such as interconnection, phosphor deposition, and encapsulation will be elaborated in detail. Considerations in thermal management will be addressed. Efforts will also be made to investigate optical design, analysis and characterization. Applications of HB-LED for general lighting will be illustrated. In addition, the technology roadmap and IP issues will be discussed.

Course Outline

• Review of electroluminescence and lighting technology trends
• Overview of packaging structures of LED
• Chip interconnection technologies
• Phosphor deposition for color tuning
• Encapsulation materials and processes
• Materials for heat dissipation and thermal Management
• Optical design, analysis and characterization
• HB-LED arrays for general solid state lighting
• HB-LED modules for special lighting applications
• Reliability engineering of HB-LED packaging
• Technology roadmap and patent mapping
  

Brief Biography of Instructor

Dr. Ricky Lee received his Ph.D. degree from Purdue University in 1992. Currently he is Professor of Mechanical Engineering at the Hong Kong University of Science & Technology (HKUST) and Director of HKUST LED-FPD Technology R&D Center at Foshan. His research activities cover flip chip technologies and wafer level packaging, through silicon vias and 3D packaging, LED and optoelectronics packaging, lead-free soldering and solder joint reliability. Ricky has substantial publications in international journals/conference proceedings. He also co-authored three books and owns several technical patents. Ricky is Fellow of IEEE, ASME, and Institute of Physics (UK). In addition, he was elected IEEE CPMT Distinguished Lecturer and received IEEE CPMT Electronics Manufacturing Technology Award. Ricky is the project leader for the implementation of HB-LED SSL on Hong Kong subway trains.

Attendance  Fee:

RMB 1100  （For One Person a day）

Contact:

Creativity Convention & Exhibitions.

Tel: 0755-8831 2775

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