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| Flexible Printed Circuits and IPC 6013 Workshop
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| Date: October 12-13, 2005 |
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| Venue: Shenzhen China |
IPC is putting together this workshop just for YOU! The workshop will discuss performance classes and fabricator¡¯s capabilities as well as thoroughly cover IPC 6013 - Qualification and Performance Specification for Flexible Printed Boards.
You will learn
Tolerances on Printed Board features ¨C ¡°conductor spacing¡±, ¡°plating voids¡±, ¡°Hole Breakouts¡± and much more¡
Quality Assurance Requirements ¨C ¡°inspection sample size¡±, ¡°magnification requirements¡± etc.
Course Outline
| Intrductin |
Discuss perfrmance classes and fabricatrs¡¯ capabilities. |
| Relating t ther IPC 6010 Series |
Flexible circuit applicatins and market |
| Substrate material selectin and standards |
Design guidelines fr flexible circuits |
| SMT assembly prcess requirements |
Scpe f IPC 6013 |
| Applicable dcuments |
Requirements |
| Cvering IPC 6013 Sectins 3.1 ¨C 3.11.6 |
Quality Assurance Prvisins |
The Instructor¡
Vern Solberg has more than thirty years of experience in the design and manufacturing of electronic products. Following studies in Industrial Design at the ¡®Art Center School of Design¡¯ in Los Angeles California, Vern worked in design and development of specialized electronic products for both commercial and aerospace industries. Following a several years supporting communications and defense systems development he joined Dana Laboratories and later EIP Microwave, leading manufacturers of test and measurement equipment. Mr. Solberg went on to establish a service bureau, NuGrafix Group, specializing in high-density electronic packaging for a customer base that included NASA, Fairchild Camera, Hewlett-Packard and other Silicon Valley corporations.
The company was purchased in 1986 by SCI Systems, a multinational Fortune 500 company based in Huntsville, Alabama. Vern served SCI as the Manager of Design Engineering and Principle Engineer for the companies Pacific Division for eight years, developing a corporate SMT design manual for circuit board design, providing circuit board design services, in-house training and concurrent engineering support to IBM, Hewlett-Packard, Seagate, Apple and other primary customer companies.
In 1994 Mr. Solberg joined Tessera, an engineering company specializing in microelectronic product development, and the developer of the mBGA, a miniature IC package technology. His primary activities with Tessera have been related to design engineering and assembly process development, where he continues to support special projects and continues as a technical advisor to in-house as well as OEM customer engineers and design specialists.
In addition, Mr. Solberg is a writer and author of ¡®Design Guidelines for Surface Mount and Fine-Pitch Technology¡¯ has contributed to three other books on packaging for McGraw-Hill Publishing. Vern has been a teacher and lecturer for several US universities and trade organizations including IPC, focusing on product quality and design for manufacturing. As a Consulting Engineer, Mr. Solberg specializes in manufacturing process refinement for high-density electronics, cost control, cost reduction and product quality improvement related to design and assembly for surface mount technology and micro-electronics. |
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