Organizer: IPC and IPC Shanghai
Creativity Convention & Exhibition (Shenzhen) Co., Ltd
A New Technical Conference is Here!
IPC is announcing a new conference in southern China in conjunction with Elexcon part of the enormously successful China Hi-Tech Fair held in Shenzhen each year. IPC Works Asia will bring the technical excellence of the IPC along with technical committee activities that have been in place at IPC meetings for 50 years. You are invited to get in on the ground floor of this inaugural industry event.
Presentations from technical experts are sought on all relevant subjects, including:
Lead Free Implementation
· Printed Board Solderability
· Solder Joint Reliability
· Tin Whiskers
Board Fabrication
· Advances in Plating Technology
· Advances in Flex and Rigid-Flex
· Via Fill Technology
Board Design
· Embedded Passives
· Advances in CAD/CAM
· Fine Pitch Design
Assembly Technology
· BGA Attachment Reliability
· Rework and Repair
· No Clean Processes
Board Materials
· New Laminates
· Materials Testing
· High Frequency Laminates
Benefits of Participating
Increase your visibility in the industry, and that of your company, by participating in the IPCWorks Asia 2007 technical conference. Many industry leaders use the research and findings from conference proceedings when they develop industry standards and guidelines.
Technical Presentations and/or Papers
The Technical Conference will be held Monday and Tuesday October 15-16, 2007. Abstracts for unpublished work should be submitted detailing case histories, field data, new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used results of experiments and benefits to the industry.
Presentations at the conference may be thirty minutes in length. They may be grouped together in a forum or panel discussion.
Presentations must be non-commercial in nature, focusing on technology rather than a company’s product. Those deemed commercial by the Technical Program Committee will not be accepted. Abstracts must be submitted by July 18, 2007.
Professional Development Courses
Proposals are solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) Professional Development Courses on design, printed circuit board and electronic manufacturing processes and materials.
Proposals including course descriptions must be submitted by July 18, 2007. A master copy of the course workbook must be submitted by September 14, 2007. An honorarium is offered to Professional Development Instructors. Contact Alexandra Curtis at +1 847-597-2877.
Proceedings
Please note: It is mandatory for all speakers and instructors to provide an electronic copy of their technical paper and/or presentation slides. The deadline for paper/visuals submission is September 14, 2007.
Conference Speaker Benefits
All conference speakers at IPCWorks Asia 2007, will receive free conference admission and a complimentary copy of the conference Proceedings on CD.
Agenda
15-16. OCT, 2007
Grand Meeting Room，4th Floor, Shenzhen Int’l Chamber of Commerce Tower
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DAY ONE MORNING 2007.10.15 Grand Meeting Room 4th Floor, Shenzhen ICCT |
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09:30 - 09:40 |
Topic： Opening Remarks
Speaker：Mr. David Bergman, Vice President, IPC |
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09:40 -10:25 |
Topic： Process Requirements for High Density SMD Placement
Speaker：Sjef van Gastel, Manager Advanced Development, Assembléon Netherlands B.V (Bronze Sponsor) |
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10:25 - 10:35 |
Break |
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10:35 - 11:20 |
Topic： Advanced Copper Microetching Technology
Speaker： Mr. Zheng Bo, Cookson Electronics - Enthone (Bronze Sponsor) |
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11:20 - 12:05 |
Topic: Optimizing Rheology for Package-on-Package Flux Dip Processes
Speaker：Mr. Andy Yuen, Cookson Electronics - ALPHA (Bronze Sponsor) |
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DAY ONE AFTERNOON 2007.10.15 Grand Meeting Room 4th Floor, Shenzhen ICCT |
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13:30 - 14:00 |
Topic：Case Study on the Validation of SAC305 and SnCu Based Soldiers in SMT, Wave and Hand Soldering at Contract Assembler Level
Speaker：Mr. James Wang, Market Development Engineering Manager, Kester (Bronze Sponsor) |
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14:00 - 14:30 |
Topic： Novel Material for Lead-free PWB
Speaker：Mr. Tim Lee, Marketing Manager, Doosan Corporation Electro – Materials BG |
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14:30 - 14:45 |
Break |
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14:45 - 15:15 |
Topic： Efficient Use of Nitrogen for a Full-Tunnel Wave Soldering Oven
Speaker：Mr. Hiew Pang Ling, Sr. Process Specialist, Linde Group |
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15:15 -15:45 |
Topic： Development of High Drop Performance Solder Ball
Speaker：Mr. Hyun-Kyu Lee, R&D Center, Duksan Hi-Metal Co., Ltd |
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15:45 - 17:00 |
Panel Discussion
Topic: TBA |
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DAY TWO MORNING 2007.10.16 Grand Meeting Room 4th Floor, Shenzhen ICCT |
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09:30 - 10:00 |
Topic: Overview of the U.S. Standards and Conformity Assessment System
Speaker：Ms. Elise Owen, American National Stander Institute |
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10:00 - 10:30 |
Topic： Lead-Free Manufacturing Reliability
Speaker：Ms. Wang Yuming, Director, SMT Lab, Tsinghua University |
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10:30 - 10:45 |
Break |
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10:45 - 11:15 |
Topic： Fine Pitch Printing Process On Large Size Board
Speaker：Mr. Shi Xiting, Huawei Technologies Co., Ltd |
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11:15 - 11:45 |
Topic： High Reliability Lead-free Soldier SN100C(Sn-0.7Cu-0.05Ni+Ge)
Speaker：Mr. Satoshi Mizuta, Overseas Business Development, Nihon Superior |
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Conference Sponsor：
At IPCWorks Asia 2007 Workshops
★ IPC Certified Interconnect Designer (CID)
Oct 12-14, 2007, 8:30am – 5pm
Venue: Business Center Meeting Room, Shenzhen Donghua Holiday Inn Hotel
Workshop Instructor
Ms. Leesha Peng，Director of Technical Resources, Standards & Design Programs, IPC Global Technology Management Consulting (Shanghai) Co., Ltd.
★ RoHS Data Management Workshop for Electronics Industries
Oct 17, 2007, 8:30am – 12:30pm.
Venue：No.1 Meeting Room, 4th Floor, Shenzhen Int’l Chamber of Comerce Tower
Course Instructors
Ms Annie Kong - Senior Consultant, Hong Kong Productivity Council
Mr Daniel Sum – Consultant, Hong Kong Productivity Council
About China Hi-Tech Fair ELEXCON 2007
China Hi-Tech Fair(CHTF), jointly hosted by the nine ministries and commissions at the state level and Shenzhen Municipal Government and first held in 1999 after being approved by the State Council, is held in Shenzhen, China annually from Oct.12-17 with total space of 100,000sqm. It has become China’s most famous and influential event characterized by its “state-level, internationalization, high-level, large scale, and specialization”.
China Hi-Tech Fair ELEXCON is one of the important part of the event, with total space of 15,000sqm (Hall 2), and the exhibition categories cover electronic manufacturing equipment, materials, instruments, and components, and attracted many industry top players to join, including Panasonic, Siemens, Universal, Fuji, Assembleon, 3M, ,Henkel, Sony Chemical, Nitto Denko, Rogers, Cooksen… …
Contact :
Mr. Rayman Yau Ms. Audrey Sytsma / Sally Cai
Creativity Convention & Exhibition (SZ) Ltd. IPC
Tel: 86 755-8831 2782
Mobile: 13590198987 Tel: 86-21-54973435/
Fax: 86 755-8831 2533, 8831 5466 &n, bsp; Fax: 755-21-54973437&, nbsp;
http://www.elexcon.com http://www.ipc.org/WOFE |
