• Integrated Circuit and Semiconductors
• Embedded Technology
Embedded processor, RISC-V, storage, industrial display, industrial power supply, operating system, application software, test and measurement and tools, IoT solutions, etc.
• Passive Components Discrete Device
• Power and Power Devices
• Interconnection and Switch
• Test and Measurement New Materials and Processes
• Advanced Packaging and Testing
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• Embedded System and AIoT Technology Pavilion
Embedded processor, RISC-V, storage, industrial display, industrial power supply, operating system, application software, test and measurement and tools, IoT solutions
• SiP and Advanced Packaging and Testing Zone
SiP packaging design, testing, equipment and applications; IC design, manufacturing and packaging and testing, EDA, semiconductor materials and processes
• Power Supply, Power Device and Third-generation Semiconductor Zone
Power supply, power management chip, circuit protection chip, power device, third-generation semiconductor device
• 5G Technology Zone
5G key technologies, 5G core components (RF chips, antennas, power amplifiers, etc.), 5G commercial terminals and solutions
• Automotive Electronics Technology Zone
Smart cockpit, autonomous driving, V2X car networking, charging piles, battery swap systems, car batteries and BMS, car radar, etc.
• TWS and Wearable Technology Zone
New technology products and solutions such as Bluetooth master control, audio, power management, touch control, packaging and testing, human-computer interaction, sensors, etc.
• MEMS and Sensor Zone
MEMS R&D and manufacturing, MEMS and smart sensors include environmental/motion/biology/image/fingerprint/laser/millimeter wave sensors
• Integrated Circuit and Semiconductors
• Embedded Technology
Embedded processor, RISC-V, storage, industrial display, industrial power supply, operating system, application software, test and measurement and tools, IoT solutions, etc.
• Passive Components Discrete Device
• Power and Power Devices
• Interconnection and Switch
• Test and Measurement New Materials and Processes
• Advanced Packaging and Testing
------------------------------------------------------------------------------------------
• Embedded System and AIoT Technology Pavilion
Embedded processor, RISC-V, storage, industrial display, industrial power supply, operating system, application software, test and measurement and tools, IoT solutions
• SiP and Advanced Packaging and Testing Zone
SiP packaging design, testing, equipment and applications; IC design, manufacturing and packaging and testing, EDA, semiconductor materials and processes
• Power Supply, Power Device and Third-generation Semiconductor Zone
Power supply, power management chip, circuit protection chip, power device, third-generation semiconductor device
• 5G Technology Zone
5G key technologies, 5G core components (RF chips, antennas, power amplifiers, etc.), 5G commercial terminals and solutions
• Automotive Electronics Technology Zone
Smart cockpit, autonomous driving, V2X car networking, charging piles, battery swap systems, car batteries and BMS, car radar, etc.
• TWS and Wearable Technology Zone
New technology products and solutions such as Bluetooth master control, audio, power management, touch control, packaging and testing, human-computer interaction, sensors, etc.
• MEMS and Sensor Zone
MEMS R&D and manufacturing, MEMS and smart sensors include environmental/motion/biology/image/fingerprint/laser/millimeter wave sensors