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ELEXCON 深圳国际电子展

November 6-8
2022
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【动态五】芯和、晶方、思立康:产业专家共话SiP与先进封装技术前沿动态及趋势
2022-07-01
在前四篇采访推文中,即将开幕的2022中国系统级封装大会(SiP China)深圳站和苏州站主办方邀请了:来自华封科技、爱德万测试;云天半导体;安似科技;西门子EDA、杜邦、先进封装科技的专家们分享了SiP与先进封装技术前沿动态及趋势。下面一起来听听芯和半导体、晶方半导体、思立康技术这三家封测产业链厂商的看法。
【动态六】歌尔微、德龙激光、洁创:产业专家共话SiP与先进封装技术前沿动态及趋势
2022-07-01
在前五篇采访推文中,即将开幕的2022中国系统级封装大会(SiP China)深圳站和苏州站主办方邀请了:来自华封科技、爱德万测试;云天半导体;安似科技;西门子EDA、晶方半导体、思立康技术;杜邦、芯和半导体、先进封装科技的专家们分享了SiP与先进封装技术前沿动态及趋势。下面一起来听听歌尔微电子、德龙激光、洁创贸易这三家封测产业链厂商的看法。
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Event Time
November 6-8,2022
Venue
ChinaShenzhenHall 1&9
Organizer
Shenzhen Informa Markets Creativity Exhibition Co., Ltd.
Supporters
China Institute of Communications、The Aliance Etc
China Electronic Components Industry Association
China Semiconductor Industry Association
Shenzhen Medical Device Industry Association
Taiwan Electrical and Electronic Industry Association
TECA Taiwan Electronic Link Industry Association
China Software Industry Association Branch Of Embedded System
IEEE
Phone
86-755-8831 1535
Fax
86-755-8831 2533
Email
elexcon.sales@informa.com
Address
High-Tech Park,district,Nanshan District, Shenzhen
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