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ELEXCON 深圳国际电子展

奥肯思(北京)科技已确认参展2018深圳国际电子展

奥肯思(北京)科技有限公司

 

展位号:2G20    
 

 

产品介绍:

 

SiP及封装全流程设计仿真平台
 

相对于传统的设计仿真平台,SiP设计仿真需要具备键合线、腔体、芯片堆叠、RF射频电路、埋入式电阻电容等功能。3D显示功能要求效果好,可在3D环境中进行布局、测量等操作;其仿真工具能够正确建模并仿真键合线、腔体、芯片堆叠等3D立体结构并能够进行快速建模和仿真。


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Event Time
14-16 Sept.,2022
Venue
ChinaShenzhenWorld Exhibition & Convention Center Hall 5/6/7/8
Organizer
Shenzhen Informa Markets Creativity Exhibition Co., Ltd.
Supporters
China Institute of Communications、The Aliance Etc
China Electronic Components Industry Association
China Semiconductor Industry Association
Shenzhen Medical Device Industry Association
Taiwan Electrical and Electronic Industry Association
TECA Taiwan Electronic Link Industry Association
China Software Industry Association Branch Of Embedded System
IEEE
Phone
86-755-8831 1535
Fax
86-755-8831 2533
Email
elexcon.sales@informa.com
Address
High-Tech Park,district,Nanshan District, Shenzhen
Shenzhen UBM Creativity Exhibition COPYRIGHT © 2000-2020 粤ICP备09166010号