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ELEXCON 深圳国际电子展

苏州诺德森电子设备已确认参展2018深圳国际电子展

苏州诺德森电子设备有限公司

 

展位号:2H21  
 

 

主营产品:

 


产品介绍:

 

诺信高科技事业部在半导体及先进封装的多个领域是业界领先者。隶属于诺信的公司有Nordson ASYMTEK—点胶/涂覆,Nordson DAGE—焊接强度测试及材料测试,Nordson DAGE—离线X-Ray检测,Nordson DIMA—热压熔锡焊接,Nordson MARCH—等离子处理,Nordson MATRIX—全自动在线X-Ray检测,Nordson SELECT—选择性波峰焊,Nordson SONOSCAN—超声显微成像检测,Nordson YESTECH—全自动光学检测。

 

 

先进封装点胶/涂敷应用

 

诺信高科技事业部在半导体及先进封装的多个领域是业界领先者。隶属于诺信的公司有Nordson ASYMTEK—点胶/涂覆,Nordson DAGE—焊接强度测试及材料测试,Nordson DAGE—离线X-Ray检测,Nordson DIMA—热压熔锡焊接,Nordson MARCH—等离子处理,Nordson MATRIX—全自动在线X-Ray检测,Nordson SELECT—选择性波峰焊,Nordson SONOSCAN—超声显微成像检测,Nordson YESTECH—全自动光学检测。

 

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Event Time
14-16 Sept.,2022
Venue
ChinaShenzhenWorld Exhibition & Convention Center Hall 5/6/7/8
Organizer
Shenzhen Informa Markets Creativity Exhibition Co., Ltd.
Supporters
China Institute of Communications、The Aliance Etc
China Electronic Components Industry Association
China Semiconductor Industry Association
Shenzhen Medical Device Industry Association
Taiwan Electrical and Electronic Industry Association
TECA Taiwan Electronic Link Industry Association
China Software Industry Association Branch Of Embedded System
IEEE
Phone
86-755-8831 1535
Fax
86-755-8831 2533
Email
elexcon.sales@informa.com
Address
High-Tech Park,district,Nanshan District, Shenzhen
Shenzhen UBM Creativity Exhibition COPYRIGHT © 2000-2020 粤ICP备09166010号