Mr. Zhou Yun entered the semiconductor industry in 2009 and has been working in the semiconductor industry for 10 years. He joined TENSUN in 2010 and is mainly responsible for the operation of the Semiconductor Equipment Business Division and serves the advanced packaging customers in mainland China. He has a deep involvement in the advanced packaging industry and provides the best solutions for the advanced packaging customers.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has over 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. He has a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University.
Dr. Jing Zhang, head of Shanghai Innovation Center, Heraeus Electronics China, graduated from Delft University of Technology. His research of interests includes power electronic packaging material, process and reliability. In 2017, he joined Heraeus, focusing on advanced packaging and reliability evaluation for the WBG semiconductor devices. Dr. Zhang has led or participated in more than 30 domestic and international R&D projects worth more than 90 million RMB. He has also undertaken projects worth 40 million RMB as the first responsible person. Results of these projects have been transferred to many industries including new energy vehicles, high-speed rail and semiconductor lighting. He has published 20 papers, authored 1 book chapter and presented 9 reports as invited speaker at international academic conferences. Dr. Zhang is the Founding Chairman of IEEE Electronics Packaging Society (EPS) Benelux Branch, the Executive Secretary of the International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), and a member of the Packaging Working Group. He also serves as a member of the Technical Committee of the Center for Shanghai Silicon Carbide POWER Devices Engineering & Technology Research, a member of the Youth Committee of the China Advanced Semiconductor Industry Innovation Alliance, a member of the Packaging Branch of the China Third Generation Semiconductor Roadmap Committee, and a member of the Nanotechnology Sintered Material Standardization Committee. He is an off-campus supervisor of master’s students at Fudan University.
Leon Jiang graduated from Zhejiang University with Ph.D. in Physics, and had a Post-Doctor in Fudan University. Since 2005, Leon worked in Saint-Gobain, Dow Chemical and DuPont for technology development, market development and corporate investment, as R&D Manager, Corporate Venture Manager and Corporate Account Executive. Currently Leon is Market & Business Development Leader for Interconnect Solutions Business in DuPont, responsible for the business development of IC substrate materials and solutions. During his 12 years' career in Dow & DuPont, Leon focused on new technical investment and new business development especially in Electronic Materials.
Mr. Phil Ouyang is a veteran with more than 10 years’ experience in electronics manufacturing industry. He specializes in test & measurement and produciton line automation. With extensive understanfing of technology trends, he knows how to land a project from laboratory to production floor.
Davy Dai is responsible for system-level EDA product planning and marketing, with 20 years of experience in PCB board-level, package-level design and support, and rich experience in EDA product research and development. With joint efforts of the company's powerful R&D team and targeted the system-level electronic design market, we will deliver excellent commercial EDA solutions with the industry-best application practices.
Jesse Zhang, Group Director of SEMI China. Jesse joined SEMI in 2014, he is primarily responsible for SEMI’s Industry Programs and Member Service in Semiconductor and Display in China. Jesse Zhang received a bachelor’s degree of Electronic Engineering from Soochow University and MBA from Tongji-ENPC. He has over 20 years’ of experience of Technology and Marketing in Semiconductor industry. Prior to SEMI, Jesse Zhang served AMD/Intel/Qimonda in various Engineering Management positions. He received the IAA (Intel Achievement Award) for the outstanding contributions to Pentium 4 chipset ramp up project.
Si Chen，Director of Packaging System Engineering of Unisoc, received his PhD from Chalmers University of Technoloyg, experience in advanced packaging materials, microwave module processing, packaging design and engineering, thermal and mechanical design and simulation.
Wenliang Dai is currently Co-Founder and SVP of Xpeedic, a leading EDA software provider. Dr. Dai has over 20 years of industry experience in EDA, RF front end, and system-in-package. Dr. Dai received his Ph.D. degree in Shanghai Jiaotong University. He is an Engineering Expert (Integrated Circuit) for National Information Technology Talent Training in MIIT China , the guest chief expert in Microsystems for CETC , and former senior technical consultant of Cadence Shanghai Global R&D Center. He is also an international journal for IEEE TMTT, IEEE TAP, DAC, etc.
Mr. Tony Yang is currently Dept. Manager of SiP Product Development at ASE (ASE Chungli), in charge of SiP product and process development. He focuses on IC assembly new material R&D, SiP application and structure development, SiP new process and automation development, TWS and Hearing Aid wearable product development and IoT Vertical Manufacture Integration.
Mr. Du Maohua has 20 years of packaging R&D experience. He graduated from Tsinghua University with a bachelor's degree and a master's degree from the Chinese Academy of Sciences. He joined TFME in 2020 and currently serves as the director of strategic planning department. Before joining TFME, Mr. Du Maohua worked in Samsung Semiconductor R&D for nearly 17 years, mainly responsible for new products and new technologies development. He has 10 papers published and nearly 60 patent applications, of which 27 have been authorized.
Mr. Lincoln Lee joined Mentor Graphics (now Siemens EDA) in 1988 based in Hong Kong office covering PacRim region. He was one of the first Application Engineers supporting Mentor’s activities in China. Mr. Lee transferred to Mentor Canada in 1991 and since then contributed in various roles, including Product Specialist, Business Development Manager, and Strategic Account Principal Technical Manager. In the latter position, he led a global team of AEs covering a broad range of technologies from system level design to silicon production. During his tenure, Lincoln pioneered using layout aware scan diagnosis for silicon yield learning which led to award winning paper at International Test Conference. His work also resulted in changes to IC industry’s design practices such as litho process check and double patterning decomposition to meet new silicon process challenges. Siemens acquired Mentor Graphics in March 2017. Mr. Lee relocated to Shanghai in 2018 as the PacRim Technical Director. Lincoln has B. Eng. degree from McMaster University, Ontario in Computer Engineering, and MBA degree from Queen’s University, Ontario.
A senior application engineer of Zuken. Has around 20 years working experience in electronic design, simulation and DFM. Full knowledge on IC packaging, car electronics, smart terminal and high speed communication design.
Mr. Zhu Jundong is currently working at Kiwimoore as the Vice President of Products and Solutions. Mr. Zhu is a comprehensive market expert in the chiplet field, with 16 years of IC experience. He once served as the Product Director of NXP Semiconductor intelligent identification market and the R&D Director of Motorola.
Joined Shennan Circuits Co., Ltd after graduating from Northwestern Polytechnical University in July 2011,and served as the project manager for the MPP module of the R&D department. In August 2015, transferred internally to SCI,as the Project Manager/ Product Manager of R & D department, mainly responsible for the evaluation and import of SiP /Module projects, customer development and import of focused product. He is currently the director of SiP / Module Product Department.
As the Director of business development director of Advantest(China) Co.,Ltd., Ge Liang is responsible for the solution implementation and market expansion of new technology/new business in SoC testing field. He has been working in Advantest for more than 15 years, engaged in chip testing related applications, R&D and marketing. Ge Liang received his master degree in electromagnetic field and microwave technology from Shanghai Jiao Tong University in 2005.
Founded in 1978 and established the own brand "GPM", Gallant Precision Machining (GPM) (TWSE: 5443) was listed on the Taiwan Stock Exchange in 1998. Starting out as a manufacturer of mold parts and components for semiconductor equipment, GPM gradually entered the process equipment, automation equipment, and precision mold part and component industries in 1985. Later in 2002 and 2006, GPM merged respectively with Kingbond and Kingroup Systems to enhance process technology R&D, production, and manufacturing capabilities, thus allowing it to successfully enter the core supply chain of LCD, PV, PCB, biomedical, robot, and smart automation industries. Today, GPM products and services are distributed throughout Asia, with accounts across Greater China and Southeast Asia.
Eric Wang, founder / Chairman of Suzhou ACCURACY Assembly Automation Co., Ltd. He was awarded many talent honors. Since the founding of ACCURACY, through independent innovation, it has developed eight series, more than 40 types of semiconductor assembly equipment, and its products have entered the mass production line of the world's top ten assembly plants, realizing import substitution in the field of medium and high-end assembly equipments.
Russell joined the China WLCSP in 2009 as VP Sales&Marketing. His prior work experience includes multiple technical and operational positions with various tech company in the electronics and semiconductor industries in N.A, ie. Dynamotion（NASDAQ:DYNA），Electro Scientific Industries（NASDAQ：ESIO）and Photon Dynamics（NASDAQ：PHTN). Russell had his undergraduate study in engineering at SJTU in China and graduate study at Virginia Tech in the US. He is currently the VP of Marketing and BD with the company.
Mr. Xu Rongfeng, currently CEO of Chipuller Technology Co., Ltd., is responsible for the strategic development of the company. With nearly 20 years of industrial experience, he is deeply involved in the research and development of cutting-edge semiconductor technologies.
David zhang, Sales & Marketing VP of ACCESS. 12 years experience in ACCESS. Mainly in charge of marketing developing, customer developing and Sales management.
Xu Pu is a senior engineer who obtained a degree of Master of Engineering. He is a member of the Technical Committee of the Electronic Solder Materials Branch and the general manager of Fitech. Mr. Xu has been engaged in the industrialization of scientific and technological projects since 1990. Mr. Xu has accumulated 20 years of experience in electronic solder research and application and has obtained more than 20 national and PCT patents.