Conference Agenda

• Keynote

  Chairman: Wenliang Dai,Founder and President, Xpeedic Co.,Ltd
  09:30-09:50	Registration and Networking
  09:50-10:00	Welcome	Dongmei Xu, Deputy Secretary-General and Secretary-General of the Closed Testing Branch, China Semiconductor Industry Association
  10:00-10:25	Heterogeneous Integration Systems for High-Computational AI Applications	Wenliang Dai, Founder and President, Xpeedic Co., Ltd.
  10:25-10:50	UCIe 2.0: Driving the evolution and innovation of an open core ecosystem	Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIeTM
  10:50-11:15	The Road to Personal Large Models	Alex Zhou，Chief Chip Strategy Officer，Shanghai Enflame Technology Co., Ltd
  11:15-11:40	Liyang chip integrated two wings strategic service industry development	Yeefeng Zhang, General Manager, Guangdong Liyang Chip Testing Co.,  Ltd, President, Dongguan Integrated Circuit Industry Association
  11:40-12:05	Packaging Innovation & Future by Heterogeneous Integration	Scott Chen, Sr. Vice President, ASE Technology holding Co.Ltd
  12:05-12:30	Interpretation of Global and Chinese Semiconductor Market Data	Wenxin Gu, Director of Semiconductor Business Development, SEMI
  12:30-13:30	Lunch Break & SiP Zone

• Session 1: Heterogeneous system integration applications

  Co-Chairman:Jian Chen, Chief Cloud Server Architect and Director of Engineering in Alibaba Cloud, member of Board of Directors of CXL and UCIe
  13:30-13:55	The Development and Challenges of Heterogeneous Integration	William Qiu， Director， Unisoc (Shanghai) Technologies Co., Ltd
  13:55-14:20	Innovative Exploration of Integrated Solution of Chiplet System SiP, UCIe and 3DIC technology	Dr. Wang Yingchun, Senior Director of IP Technologies, Synopsys
  14:20-14:45	VeriSilicon's Chiplet Technologies Empower Autonomous Driving and High-performance Computing Solutions	Yinlong Chen, Vice President of Packaging Engineering of the Chip Platform Division,  VeriSilicon Microelectronics (Shanghai) Co., Ltd
  14:45-15:10	3DIC multi-physics challenges and coping strategies	Shuqiang Zhang, Ansys China Semiconductor BU ACE Director, ANSYS
  15:10-15:35	Breakthrough solves some key problems in the design and verification of 2.5D/3D chiplets	Yubin Zhao, Marketing Director, BTD Technology
  15:35-16:00	Chiplet & D2D IP, the road to achieve high performance chip	Eric Ma, Sales VP, kiwimoore
  16:00-16:25	EDA Enables Signal Integrity Design for High Speed Interconnects of HPC Chiplet Systems	Xiaobo Huang, Director of Technical Marketing, Xpeedic Co., Ltd

• Session 3: Heterogeneous system integration implementation (ecosystem)

  Session Chairman: Jundong Zhu, Product and Solution VP, Kiwimoore (Shanghai) IC Co., Ltd
  09:30-10:00	Registration and Networking
  10:00-10:25	Implementation of heterogeneous system integration —— OSAT is a long way to go	Jianyong Wu, Senior Expert, JCET
  10:25-10:50	UCIe+NoC——The Die-to-Die Interconnection Solution for AI Chips	Chengxi Wang, Senior Marketing Director, Shanghai eTopus Technology  Co., Ltd
  10:50-11:15	Related applications of Chiplet chip technology in package level	Jiaen Fang, Chairman, Suzhou Rigger Micro Technologies Group Co., Ltd
  11:15-11:40	Innovations in Thermal Simulation Technology: Accelerating and Empowering the Thermal Design of Cutting-edge Electronic Products.	Jayden He, Senior Engineer, PhySim Electronic Technology Co., Ltd.
  11:40-12:05	Introduction to automotive-grade highly integrated system-level fan-out packaging platform	Yan Huo, Director of R&D, SiPLP
  12:05-13:30	Lunch Break & SiP Zone
  13:30-13:55	Research and Application of Advanced Packaging Materials for Integrated Circuits	Bin Xiao, Dean Assistant, Shenzhen Institute of Advanced Electronic Materials
  13:55-14:20	Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection	Eric Pei, Technical Manager, KLA Corporation
  14:20-14:45	New solution of SIP soldering and cleaning	Vincent Long, Technical Manager，Asia, INVENTEC Performance Chemicals (Shanghai) Co., Ltd
  14:45-15:10	HT-tech： Advanced packaging drives the development of intelligent world	Hao Zhu, TPM Manager, HT-TECH
  15:10-15:35	BGA advanced package new ball planting process	Megan Hu, Sales Director, Guangdong D-TEK Intelligent Equipment Co., LTD

• Session 4: Key Processes of TGV Glass Substrates

  Session 4: Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd , Key processes for TGV glass substrates Master of ceremonies: Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
  09:30-10:00	Registration and Networking
  10:00-10:25	Key technology and application of glass through hole	Jihua Zhang, Professor, University of Electronic Science and Technology of China, Founder & Chairman of the Board of Directors of the company, 3D CHIP
  10:25-10:50	Specialty flat glass: the key material to promote semiconductor advanced packaging	Guangjun Zhang, Senior Manager, New Business Development，SCHOTT AG
  10:50-11:15	Exploring TGV (Through Glass Vias) to enable Endless possibilities of PLP (Panel Level Packaging)	Frank Su, Senior Director of Business Development，Lam Research
  11:15-11:40	Glass Core Substrate: Next Gen Advanced Packaging Technology	Jiamiao Tang, General Manager, Antelimervi FCBGA, AKM Meadville Electronics (Xiamen) Co., Ltd
  11:40-12:05	Progress, application and challenges of advanced through glass via technology	Jovin lee, Marketing Director, Xiamen sky semi conductor teconology Co.,Ltd
  12:05-13:30	Lunch Break & SiP Zone
  13:30-13:55	High-density Glass Substrate--ROS technology	Zhidong Li , VP, Thinktrans Semiconductor Technology Ltd
  13:55-14:20	PVD Sputter Tool for Large-Size Panel TGV	Xiaojun Zhang, Chairman&Chief Scientist, Arrayed Materials (China) Co., Ltd
  14:20-14:45	Plating of Through-Glass-Vias：Single Panel Processing Platform	LANG MARCUS ELMAR, CTO, Simetric Semiconductor Solutions Co., Ltd
  14:45-15:10	Laser glass through-hole technology promotes TGV industrialization	Ben Lee, VP, Sales & Marketing, Wuhan DR Laser Technology Co., Ltd
  15:10-15:35	Host TGV glass substrate critical measurement technology	Jiehao Shi, Deputy General Manager, Zhengying (Shanghai) Technology Co., Ltd
  15:35-16:00	Fozhixin TGV process challenges and solutions	Tingyu Lin, Chief Scientist, Fzxsmc