Industry Information

Exhibition Information Industry Information Exhibitor Information Photos and Videos

North China Innovation Holdings Xinyuan Micro; Samsung explores using Corning glass to develop packaging interposers!

News HighlightsSemiconductor M&A blockbuster: North China Innovation Holdings Xinyuan Micro!Samsung explores using Corning glass to develop packaging interposers! I. A Blockbuster in Semiconductor Mer...
2025-03-18 10:03 查看更多>
Synopsys' acquisition of Ansys has been approved

Sassine Ghazi, President and CEO of Synopsys, emphasized during a recent earnings call that customer support for the acquisition will "pave the way for new AI - driven design solutions that blend elec...
2025-03-07 10:03 查看更多>
Comprehensive analysis of the market prospects for glass - based chip substrates, covering technology, applications, regional competition, and future trends!

01 Market Drivers1.1 Requirements for Technological Upgrades•5G/6G Communication: High - frequency signal transmission demands that substrate materials have low dielectric loss and high signal integr...
2025-02-28 10:02 查看更多>
ASE Technology Holding Co., Ltd. is seizing the opportunity of "Fan - Out Panel - Level Advanced Packaging"; Applied Materials suffered a revenue loss of 400 million US dollars due to the China - US chip ban; The semiconductor industry in Taiwan

News Highlights1. ASE Technology Holding Co., Ltd. is vying for the "Fan - Out Panel - Level Advanced Packaging" market.2. Applied Materials suffered a revenue loss of 400 million US dollars due to th...
2025-02-28 09:02 查看更多>
The 2024 financial report of Amkor Technology; King Yuan Electronics officially announced that it will end its packaging business on June 30 this year; The advanced packaging project in which Zowee Microelectronics has 100% control has been launched in Wu

News Highlights •Amkor Technology's 2024 Financial Report: The leading packaging and testing enterprise explores new development paths. •King Yuan Electronics officially announced that it will end...
2025-02-25 17:02 查看更多>

Home Exhibition Visitor Meeting News About Us

elexcon Shenzhen International Electronics Show

0755-88311535

Email：elexcon.sales@cetimes.com

Time：August 26-28, 2025

Location：Shenzhen Convention and Exhibition Center (Futian)

Friendship link: 东芯

Subscribe to the elexcon email

Corporate Wechat

Video Account

WeChat Public Account

Consult Now

Contact Number：
0755-88311535

North China Innovation Holdings Xinyuan Micro; Samsung explores using Corning glass to develop packaging interposers!

Synopsys' acquisition of Ansys has been approved

Comprehensive analysis of the market prospects for glass - based chip substrates, covering technology, applications, regional competition, and future trends!

ASE Technology Holding Co., Ltd. is seizing the opportunity of "Fan - Out Panel - Level Advanced Packaging"; Applied Materials suffered a revenue loss of 400 million US dollars due to the China - US chip ban; The semiconductor industry in Taiwan

The 2024 financial report of Amkor Technology; King Yuan Electronics officially announced that it will end its packaging business on June 30 this year; The advanced packaging project in which Zowee Microelectronics has 100% control has been launched in Wu

elexcon Shenzhen International Electronics Show

0755-88311535

Subscribe to the elexcon email