News Highlights
•Amkor Technology's 2024 Financial Report: The leading packaging and testing enterprise explores new development paths.
•King Yuan Electronics officially announced that it will end its packaging business on June 30 this year.
•The advanced packaging project in which Zowee Microelectronics has 100% control has been launched in Wuxi.
1. Amkor Technology's 2024 Financial Report: The Leading Packaging and Testing Enterprise Explores New Development Paths
Amkor Technology's 2024 financial report shows that the company continues to maintain its leading position in the global semiconductor packaging and testing field. Despite facing macro - economic fluctuations and supply chain challenges, through technological iterations and market strategy adjustments, it achieved breakthrough growth in the field of advanced packaging. The annual net sales reached 6.318 billion US dollars, the net profit was 354 million US dollars, and the EBITDA was 1.091 billion US dollars.
The advanced packaging product lines (such as Flip Chip, Chiplet, and 3D heterogeneous integration) have become the core growth engines, accounting for 81.9% of the total revenue, mainly benefiting from the explosive demand for AI chips and high - performance computing. However, the traditional packaging business has shrunk significantly, declining by 22.2% year - on - year. In terms of different markets, the computing market grew by 16% due to the demand from AI and data centers, while the communication, automotive, and industrial markets declined by 7% and 16% respectively. The consumer electronics market grew by 10% thanks to the demand for wearable devices and smart home products. By leveraging the low - cost production capacity of the new factory in Vietnam and enhancing automation, the company's gross profit margin slightly increased to 14.8%, and the net profit margin remained stable at 5.6%. In the future, Amkor Technology will continue to deepen technological R & D, optimize the customer structure, and accelerate the global production capacity layout to cope with industry changes and market competition.
2. King Yuan Electronics Officially Announces the End of Its Packaging Business on June 30 This Year
King Yuan Electronics, an important player in the global semiconductor packaging and testing field, announced that it will end its packaging business operations on June 30 this year, a decision that has drawn widespread attention within the industry. In recent years, King Yuan Electronics' packaging business has been in trouble as its technology and scale lag behind those of its peers. It has failed to keep up with the development of advanced packaging technologies (such as SiP, Flip Chip, etc.), resulting in a decline in product competitiveness. At the same time, the trend of industry concentration has enabled leading enterprises to gain an advantage through economies of scale. As King Yuan Electronics is relatively small - scale, its production costs have remained high, making it difficult to gain an edge in market competition. After this strategic adjustment, King Yuan Electronics will focus on its testing business to enhance its core competitiveness. This decision will not only affect the industry landscape, potentially leading to a reallocation of market share, but may also prompt other enterprises to accelerate technological innovation and industrial upgrading. Although the supply chain may face adjustments in the short term, in the long run, it will promote the optimization and integration of the industrial chain and the efficient allocation of industry resources. The semiconductor packaging and testing industry is in a period of rapid transformation, and only enterprises that keep up with the trends and continuously innovate can remain invincible in the competition.
3. The Advanced Packaging Project with 100% Control by Zowee Microelectronics Launched in Wuxi
According to statistics from the Industrial Technology Research Institute's Industrial Economics and Knowledge Center in Taiwan, China, the output value of the semiconductor industry in Taiwan exceeded NT$5 trillion for the first time in 2024, reaching NT$5.3151 trillion (approximately US$165.6 billion), a year - on - year increase of 22.4%. It is estimated that the output value of the industry will exceed NT$6 trillion in 2025, reaching NT$6.1785 trillion, a year - on - year increase of 16.2%.
Among them, the IC design, IC manufacturing, foundry, IC packaging, and IC testing industries all showed significant growth. In 2024, the output value of the foundry industry reached as high as NT$3.2438 trillion, a year - on - year increase of 30.1%. The Industrial Technology Research Institute pointed out that as end - products such as smartphones, automotive electronics, and servers gradually incorporate generative AI technology, the importance of semiconductor components has become even more prominent.
In addition, the total global semiconductor market sales in 2024 reached US$627.6 billion, a year - on - year increase of 19.1%. The annual growth rate of the semiconductor industry in Taiwan has been higher than the global average for several consecutive years, and this trend is expected to continue in 2025.