The 2nd Compound Semiconductor and Applications Forum —— Innovation in SiC/GaN Technologies, Ecosystems and Supply Chains

This conference, themed "Innovation in SiC/GaN Technologies, Ecosystems and Supply Chains", gathers compound semiconductor experts from academia, research institutions and industry to discuss technical challenges in the field. Archimedes Semiconductor, Siemens, Qingchun Semiconductor,TE Connectivity, Nexperia, and others will jointly explore innovation in SiC/GaN technologies, ecosystems and supply chains.

Conference Agenda

SiC Device Technology Innovation and Application Ecosystem

09:30-09:50	Registration and Check-in
09:50-10:00	Opening Remarks by the Conference Chair	Deputy Director, National Key Laboratory of Power Semiconductor and Integrated Technologies Liu Guoyou
10:00-10:30	Current Status and Future Trends in Power Module Packaging Technology	CTO of Archimedes Semiconductor Dr. Yang Zhou
10:30-11:00	Efficient Power Module Design and Simulation Process	Technical Marketing Engineer at Siemens Electronic Technology (Shanghai) Co., Ltd. Yu Lifu
11:00-11:30	New Generation High-Reliability SiC MOSFET Devices for Emerging Applications	R&D Director at Qingchun Semiconductor (Ningbo) Co., Ltd. Sun Botao
11:30-12:00	New Turning Points, New Environments, and New Challenges in China's Domestic Silicon Carbide Industry Development	Application Testing Center Director at Tycorun Semiconductors Beijing Co., Ltd. Gao Yuan

SiC/GaN Materials, Processes, and Supply Chain

13:30-14:00	Application of SiC MOSFET in New Energy Vehicles	Application Development Director at Shenzhen Eastestech Co., Ltd. Yu Xunfei
14:00-14:30	Efficient Cascoded and Enhancement Mode GaN FETs from Nexperia to Optimize Design Application Costs	Senior Applications Manager for the MOSFET Product Line at Nexperia Fang Zhou
14:30-15:00	Research and Application of 3D AOI Inspection Technology for Power Modules	Chairman of Xin Yecheng Intelligent Equipment (Wuxi) Co., Ltd. Chen Yejin
15:00-15:30	Advancements and Trends in Nano-metal Sintering Technology for SiC Module Packaging	Associate Professor/Ph.D. Supervisor at Beijing University of Technology Jia Qiang
15:30-16:00	Accelerated Replacement of IGBT with Silicon Carbide MOSFET Across the Power Electronics Industry	Industrial Business Department Director at Shenzhen Basic Semiconductor Co., Ltd. Yang Tongli