Conference Agenda

• Meeting Room 8 (23th)

  Keynote Chair: Ling Feng, Founder & CEO of SEMI and Semiconductor
  09:30 - 10:00	Registration and Admission
  10:00 - 10:10	Welcome Remarks	Zhou Shengming, President of Shenzhen Semiconductor Industry Association
  10:10 - 10:35	Development and Current Status of the Chiplet Industry	Ling Feng, Founder & CEO of SEMI and Semiconductor
  10:35 - 11:00	Panel - level Packaging for Chiplet and SiP	Dr. David Dai, Founder, Chairman and CEO of Vistar Semiconductor
  11:00 - 11:25	Universal Chiplet Interconnect Technology (UCIe™): An Open Interconnect Standard for Chip Innovation	Dr. Debendra Das Sharma, UCIe™ Consortium Chair, Intel Senior Researcher, and Co - General Manager of Intel's Memory and I/O Technology Division
  11:25 - 11:50	Chiplets and Advanced Heterogeneous Integration for Future Computing	Dr. Wu Zhengda, Director of Samsung Electronics
  11:50 - 12:15	Chiplet Technology and Ecosystem in the Era of Computing Power	Wu Feng, Chief Engineer of High - speed Interconnect at Shenzhen ZTE Microelectronics Technology Co., Ltd.
  12:15 - 13:30	Lunch Break and Exhibition Area Visit

• Meeting Room 8 (23th)

• Forum 1: Industry Application Solutions for XPU Chair: Dai Wenliang, Co - founder & Senior Vice - President of SEMI and Semiconductor
  13:30 - 13:35	Welcome Remarks by the Parallel Forum Chair
  13:35 - 14:00	Challenges and Solutions for HBM Interconnect and Signal Integrity Design in CoWoS - Silicon Interposer	Gu Yu, Packaging Design Director of Muxi Integrated Circuit (Shanghai) Co., Ltd.
  14:00 - 14:25	XPU Architecture Based on 3D Heterogeneous Computing Platform	Wang Yiyuan, Senior Director of Platform R & D at Chip - Union Technology Co., Ltd.
  14:25 - 14:50	Heterogeneous Computing and Chiplet: New Engines for the AI - Driven Computing Power Era	Zhu Jundong, Vice - President of Products and Solutions at Singular Micro (Shanghai) Integrated Circuit Design Co., Ltd.
  14:50 - 15:15	Design and Verification of System - level Chiplet	Dr. Chen Ying'an, Vice - President of R & D at Chip - Origin Electronics Technology Co., Ltd.
  15:15 - 15:40	Chiplet System Enabling High - Performance Computing	Zhang Xiaolin, Product Marketing Manager at Synopsys
  15:40-16:05	Industrial Opportunities of High - Performance 3D SIP and FC - SiP	Zhu Wenhui, Chief Scientist/Chairman of Changsha Anmuquan Intelligent Technology Co., Ltd.
  16:05-16:30	Initial Exploration of Chiplet by Unisoc (Shanghai) Technology Co., Ltd.	Liu Zhinong, Executive Vice - President of Unisoc (Shanghai) Technology Co., Ltd.

• Meeting Room 9 (23th)

• Forum 2: Design Platforms and Services Chair: Zhu Jundong, Vice - President of Products and Solutions at Singular Micro (Shanghai) Integrated Circuit Co., Ltd.
  13:30 - 13:35	Welcome Remarks by the Parallel Forum Chair
  13:35 - 14:00	Siemens EDA Helps You Conquer 3DIC Challenges	Li Lichun, Technical General Manager of Siemens EDA in the Asia - Pacific Region
  14:00 - 14:25	Discussion on Thermal Simulation Technology for Multi - source Heterogeneous Chip Packaging in the Post - Moore Era	Lai Cheng, General Manager of Xi'an CoreRich Microelectronics Co., Ltd., CoreRich Micro (Shanghai) Electronic Technology Co., Ltd.
  14:25 - 14:50	Ansys Multiphysics Solutions for Next - generation Chiplets/3DIC Design	Zou Li, Principal Application Engineer of Ansys Technology (Shanghai) Co., Ltd.
  14:50 - 15:15	Exploration of the Feasibility of Chiplet Technology from Theoretical Model to Product Realization	Xu Rongfeng, CEO of Shenzhen ChipLux Chip Technology Co., Ltd.
  15:15 - 15:40	AI - Driven Advanced Packaging Design, Analysis and Optimization for Chiplet	Zhuang Zhimin, Senior Application Manager of Cimetrix Enterprise Management (Shanghai) Co., Ltd.
  15:40-16:05	EDA Tools for Future Chiplet and Advanced Packaging Design

• Meeting Room 8 (24th)

• Forum 3: Industry Application Solutions for AI/Auto Chair:  Liu Zhinong, Executive Vice - President & Chief Supply Officer of Unisoc Technology Co., Ltd.
  09:30 - 10:00	Registration and Admission
  10:00 - 10:25	Design and Optimization of Chiplet's Silicon Interposer Channel	Liu Peng, Senior Principal Engineer of Longsys
  10:25 - 10:50	Vistar Chiplet Technology Facilitating the Design of Autopilot and High - Performance Computing Solutions	Wang Zhiwei, Senior Vice - President and General Manager of the Custom Chip Platform Business Unit of Vistar Microelectronics (Shanghai) Co., Ltd.
  10:50 - 11:15	System - level Fan - out Embedded Packaging Module for Miniaturization of Semiconductor Packaging	Huo Yan, R & D Director of CR Micro Packaging & Testing/Silex Microelectronics (Chongqing) Co., Ltd.
  11:15 - 11:40	Chiplet Technology Empowering the Integration and Innovation of Smart Vehicles	Tu Yinghao, Vice - President of Product Marketing of Chipedge Intelligent Technology (Shanghai) Co., Ltd.
  11:40 - 12:05	Application of Advanced Panel - level Packaging Technology in AI/HPC/Auto and Chiplet Heterogeneous Chip Integration	Fang Lizhi, Vice - President/Chief Technology Officer of Chengdu Yicheng Technology Co., Ltd.
  12:30 - 13:30	Lunch Break and Exhibition Area Visit

• Meeting Room 8 (24th)

• Forum 5: Materials/Substrates Chair:  Sun Rong, Director of the Institute of Materials at Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, and President of Shenzhen International Innovation Institute of Advanced Electronic Materials
  13:30 - 13:55	Research and Application of Advanced Electronic Packaging Materials	Sun Rong, Director of the Institute of Materials at Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, and President of Shenzhen International Innovation Institute of Advanced Electronic Materials
  13:55 - 14:20	Cleaning Process for Advanced Packaging Products	Tian Jian, Senior Process Engineer of ZESTRON
  14:20 - 14:45	Application of New Welding Thermal Interface Materials in Advanced Packaging	Hu Yanjie, Senior Technical Manager of East China Region at Indium Corporation
  14:45 - 15:10	Advanced Packaging Solutions for High - efficiency SiP and Heterogeneous Integration	Dr. Zhang Jing, R & D Director of Heraeus Electronics China, Heraeus Industrial Technology Materials (Shanghai) Co., Ltd.
  15:10 - 15:35	Advanced Packaging Materials CUF and LMC Solutions	Xu Longfei, Technical Manager of Shanghai Bennuo Electronic Materials Co., Ltd.
  15:35 - 16:00	Sumitomo Bakelite's SiP Material Solutions	Chen Minghan, Deputy Sales Director of Suzhou Sumitomo Bakelite Co., Ltd.
  16:00 - 16:25	Development of IPC International Standards for Packaging Substrates	Yang Liang, Standard Development Manager of IPC Asia - Pacific Region, International Electronics Industry Connection Association

• Meeting Room 9 (24th)

• Forum 4: Chiplet Manufacturing Platform OAST/Foundry Chair:  Chen Guangxiong, Senior Deputy General Manager of the Engineering Development Center of NSP Chungli Plant
  09:30 - 10:00	Registration and Admission
  10:00 - 10:25	Applications of Innovative Heterogeneous Integration	Chen Junchen, Senior Director of the Engineering Development Center of NSP Chungli Plant
  10:25 - 10:50	Packaging Solutions for Chiplet Integration	Gao Ruifeng, Deputy Head of the Technology Marketing Center of Huatian Technology (Xi'an) Investment Holding Co., Ltd.
  10:50 - 11:15	From Advanced Packaging to Advanced Microsystem Integration	Li Jinxi, Marketing Director of Xiamen Yuntian Semiconductor Technology Co., Ltd.
  11:15 - 11:40	Development of Chiplet Integration Technology for Big Data	Liu Lei, Process Director of Tianxin Technology Co., Ltd.
  11:40 - 12:05	An Analysis of Memory Packaging in SiP	Liu Kunqi, General Manager of Huizhou Biwin, Biwin Storage Technology Co., Ltd.
  12:05 - 12:30	Professional and Efficient Memory Chip Testing Solutions	Wu Kai, Deputy General Manager of Shanghai Yudu Semiconductor Technology Co., Ltd.

• Meeting Room 9 (24th)

• Forum 6: Testing/Equipment Chair:  Lin Tingyu, Chief Scientist of Guangdong Intelligent Equipment and System Integration Innovation Center
  13:30 - 13:35	Welcome Remarks	Wang Xujin, Dean of the Institute of Microelectronics and Dean of the Institute of Semiconductor Manufacturing at Shenzhen University, Academician
  13:35 - 14:00	Testing Challenges and Innovations for Advanced System - level Packaged Chips	Yan Zexin, Senior Technical Expert of the Business Development Department, Advantest (China) Management Co., Ltd.
  14:00 - 14:25	Opportunities and Challenges of Artificial Intelligence in SiP System - level Packaging Inspection under New Technical Conditions	Tang Yangshu, Chairman of Dongguan Mengtuo Intelligent Technology Co., Ltd.
  14:25 - 14:50	Universal Robots the Upgrading of Flexible Intelligent Manufacturing in the Semiconductor Industry	Zheng Yukun, Key Account Manager for the Electronics Industry, Universal Robots Trading (Shanghai) Co., Ltd.
  14:50 - 15:15	Solution to Bubble Issues in the Development of Advanced Packaging Processes	Zhang Jingnan, General Manager of Nanjing Chuli Chuang Semiconductor Technology Co., Ltd.
  15:15 - 15:40	A New Solder Bumping Process for Advanced BGA Packaging	Hu Qingsong, Sales Director of Guangdong Hongqi Chip Intelligent Equipment Co., Ltd.
  15:40 - 16:05	Mass - production Application of Advanced Packaging Equipment and Processes at the Board - level for Fuzhi Chip	Lin Tingyu, Chief Scientist of Guangdong Intelligent Equipment and System Integration Innovation Center