Conference Agenda

• Keynote: Intelligent Transportation and Green Energy Morning of August 23rd (Conference Room 3, Hall 1)

  Chairman: Liu Guoyou, CRRC scientist at Zhuzhou CRRC Times Semiconductor Co., Ltd
  09:10 - 09:20	Registration and Admission
  09:20 - 09:30	Welcome Remarks by the Conference Chairperson: Liu Guoyou, CRRC Scientist of CRRC Times Semiconductor Co., Ltd.
  09:30 - 10:00	New Progress in Wide - Bandgap Semiconductor RF and Power Device Technologies	Zhang Jincheng, Vice - President and Professor of Xidian University
  10:00 - 10:30	Energy Electronics: Integration and Innovation of Energy and Information Technologies	Ma Xiaokai, Doctor and Deputy Director of the Research Office of China Electronic Information Industry Development Research Institute
  10:30 - 11:00	Semiconductor Chip Manufacturing Defect Detection Technologies and Equipment	Li Bo, Chairman of China Opto - Electronics Equipment Co., Ltd.
  11:00 - 11:30	Technical Challenges and Overall Solutions for Automotive - grade Power Semiconductors	Xiao Qiang, Deputy General Manager of CRRC Times Semiconductor Co., Ltd.
  11:30 - 12:00	Research Progress of JFS Next - generation Silicon Carbide Trench Device Technology	Yuan Jun, Doctor and Chief Expert in Charge of Power Devices at Hubei Jiufeng Mountain Laboratory

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• Forum 1: Current Status and Progress of SiC Technology Afternoon of August 23rd (Conference Room 3, Hall 1)

  Session Chair: Luo Haihui, General Manager of CRRC Times Semiconductor Co., Ltd.
  13:30 - 14:00	Nexperia's SiC Empowers Ultra-high-performance Power Supply Applications	Gong Xianding, Senior Market Development Manager of Nexperia in China
  14:00 - 14:30	Miniaturization of Silicon Carbide Devices and the Latest Progress of Domestic Devices	Zhang Qingchun, Chairman & CTO of Qingchun Semiconductor (Ningbo) Co., Ltd., and Distinguished Professor (Ph.D. Supervisor) at Fudan University
  14:30 - 15:00	Improving the Reliability of SiC MOSFETs in Main Drive Modules	Shen Bin, Sales Director of Shenzhen Zhixin Microelectronics Co., Ltd.
  15:30 - 16:00	R&D of Packaging Technology for 3rd-Generation Semiconductors	Peng Dehua, Manager of Department 4 of ATBG R&D Center at CR Microelectronics Jietronix Technology (Dongguan) Co., Ltd.
  16:00 - 16:30	Technological Progress and Product Applications of SiC Power MOSFETs	Liu Ao, Senior Engineer and Doctor of CEEC South Group Co., Ltd.

• Forum 2: Current Status and Progress of GaN Technology Morning of August 24th (Conference Room 3, Hall 1)

• Session Chair: Xu Ke, Deputy Director of the Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences
  09:30 - 09:55	Research Progress of Silicon-based GaN Power Electronic Devices and Materials	Sun Qian, Researcher at the Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences
  09:55 - 10:20	Advanced RF Gallium Nitride Device Manufacturing Center Supporting MMIC Foundry DC-40GHz	Pei Tie, Vice-President of Suzhou NXPOWER Semiconductor Co., Ltd.
  10:20 - 10:45	Key 6G RF Technologies	Pei Tie, Vice-President of Suzhou NXPOWER Semiconductor Co., Ltd.
  10:45 - 11:05	GaN & SiC: Leading the Power Electronics Technology Revolution	Sun Hao, Senior Application Director of Navitas Semiconductor (Shanghai) Co., Ltd.
  11:05 - 11:30	High-throughput Epitaxy Solutions for Compound Semiconductors	Fang Ziwen, General Manager of AIXTRON SE in China
  11:30 - 11:55	High-throughput Epitaxy Solutions for Compound Semiconductors	Liu Xinke, Researcher and Assistant to the Dean at the School of Materials/Microelectronics Research Institute, Shenzhen University

• Forum 3: Progress of Ultra - wide Bandgap Semiconductor Technology Afternoon of August 24th (Conference Room 3, Hall 1)

• Session Chair: Long Shibing, Professor and Executive Dean of the School of Microelectronics, University of Science and Technology of China
  13:30 - 14:00	Research on the Growth and Properties of Ultra-wide Bandgap Gallium Oxide Single Crystals	Jia Zhitai, Vice-Dean of the State Key Laboratory of Crystal Materials and the Institute of New-generation Semiconductor Materials, Shandong University
  14:00 - 14:30	Research Progress of Ultra-wide Bandgap Gallium Oxide Semiconductor Vertical Power Electronic Devices	Xu Guangwei, Associate Researcher at the University of Science and Technology of China
  14:30 - 15:00	Epitaxy of Large-size High-quality CVD Single-crystal Diamond Materials	Wang Dong, Vice-Dean of the Wuhu Research Institute of Xidian University
  14:30 - 15:00	Progress in Aluminum Nitride Single-crystal Growth and Prospects for Its Applications	Wu Liang, Founder and General Manager of Optosky Technology (Hangzhou) Co., Ltd.
  15:30 - 16:00	Current Status and Development Trends of Ultra-wide Bandgap Aluminum Nitride Semiconductor Materials in RF Device Applications	Yang Qinghua, Chairman of Suzhou Han Electronics Co., Ltd.

• Forum 4: Third - Generation Semiconductor Materials and Equipment Morning of August 24th (Conference Room 10, Hall 9)

• Session Chair: Xu Xiangang, Professor and Director of the Institute of New-generation Semiconductor Materials, Shandong University
  09:30 - 10:00	Research Progress of 8-inch SiC Single Crystals	Equipment and Process Solutions for Compound Semiconductors
  09:30 - 10:00	Industrialization Progress of Silicon Carbide Epitaxy Process	Kong Lingyi, Chairman of Hangzhou Haigan Semiconductor Co., Ltd.
  10:30 - 11:00	Silicon Carbide Wafer Defect Detection Technology and Its Applications	Wu Zhouling, Chief Scientist of Hefei Zhichang Optoelectronic Technology Co., Ltd.
  10:30 - 11:00	Application of Laser Technology in the Power and Compound Semiconductor Industry	Wu Lijie, R&D Director of Dazu Semiconductor
  11:30 - 12:00	Equipment and Process Solutions for Compound Semiconductors	Zhang Yiming, Doctor at Naura Technology Group Co., Ltd.

• Forum 5: Power Semiconductor Packaging Technologies and Equipment Afternoon of August 24th (Conference Room 10, Hall 9)

• Session Chair: Chen Yuanming, Chairman of Xuantian Technology
  13:30 - 14:00	Patterned Nanoparticle Low-temperature Bonding Technology	Liu Lei, Associate Professor at Tsinghua University
  14:00 - 14:30	Precision Dynamic and Static Characteristic and Reliability Testing Solutions for Silicon Carbide Power Semiconductor Devices	Mao Saijun, General Manager of U-Chip Technology (Shanghai) Co., Ltd.
  14:30 - 14:50	Overall Solution for IGBT Module Packaging	Liu Yongwen, Deputy General Manager of Xuantian Technology
  14:50 - 15:10	High-end Automated Visual Inspection Equipment for Semiconductors	Song Shaoning, Deputy General Manager and Doctor at Shenzhen Huatuo Semiconductor Technology Co., Ltd.
  15:10 - 15:30	Reliability Testing of Automotive-grade Chips	Bu Jianming, General Manager of Hangzhou Zhongan Electronics Co., Ltd.
  15:30 - 16:00	Collaborative Robot Technologies and Applications in the Semiconductor Industry	Xu Yao, General Manager of the Industrial Logistics Business Unit of Shenzhen URCROBOT Technology Co., Ltd.
  16:00 - 16:20	Overall Solution for Advanced Packaging of SiC Power Modules	Wang Jianlong, General Manager of Suzhou Bopai Semiconductor Technology Co., Ltd.