Solutions for the Development of New Electronic and Electrical Architectures and Automotive - grade Chips

Solutions for the Development of New Electronic and Electrical Architectures and Automotive - grade Chips

Conference Agenda

Theme: Electronic and Electrical Architecture

09:30-09:35	Opening and Guest Introduction	Yuan Chengyin (tentatively invited), General Manager of National New Energy Vehicle Technology Innovation Center, Secretary-General of China Automotive Chip Industry Innovation Strategic Alliance
09:35-10:00	Development Trends and Ecosystem Acceleration of China's Automotive Chip Industry	Zou Guangcai, Deputy Secretary of China Automotive Chip Industry Innovation Strategic Alliance
10:00-10:25	To Be Determined	Wen Junpei, Head of Body and Intelligent Network Business Unit, Automotive Electronics Business Unit, Infineon Greater China
10:00-10:25	Single SoC Chip Solution to Accelerate the Intelligent Transformation of Automobiles	Erit, Head of Smart Advanced Product Marketing, Black Sesame Technologies
10:00-10:25	Current Situation of Automotive Semiconductors and the Mass-production Path of Tsinghua Unigroup Automotive Chips	Wang Xufang, Chief Marketing Officer, Beijing Tsinghua Unigroup Core Energy Technology Co., Ltd.
11:15-11:40	The Future of "Storage" in Smart Cars	Yuan Ye, Head of Automotive Electronics Market, Deca Microelectronics Co., Ltd.
11:40-12:05	Application of Reconfigurable RF Chips in Smart Cars	Li Yang, Chairman and General Manager, Guangzhou Huizhi Microelectronics Co., Ltd.

Theme: Automotive - grade Chips

13:30-13:35	Opening and Guest Introduction	Luo Lei (tentatively invited), Director of Embedded Software Engineering Center, University of Electronic Science and Technology of China
13:35-14:00	How Electronic and Electrical Architectures and In-vehicle Chips Complement Each Other	Hou Yafei, Senior Director of Digital Architecture Development Department, Hozon New Energy Automobile Co., Ltd.
14:00-14:25	Best Practices in Product Specification Management and Post-Silicon Automatic Test Verification for Automotive-grade MCU Chips	Chen Jiaming, Head of Application Technology, Shanghai Gubo Technology Co., Ltd.
14:25-14:50	Automotive-grade MCU of Micro-Semiconductor Empowers the Electrification and Digitalization of Automobiles	Xia Yu, Deputy General Manager of Automotive Electronics Business Unit, Micro-Semiconductor (Shenzhen) Co., Ltd.
14:50-15:15	To Be Determined	Chen Yi, General Manager of Automotive Business Unit, Microchip Trading (Shanghai) Co., Ltd.
15:15-15:40	To Be Determined	Cui Wenhua, General Manager, Succe-Test (Shanghai) Detection Technology Co., Ltd.
15:40-16:05	To Be Determined	Liu Fei, Marketing Director, Yuanli (Beijing) Semiconductor Technology Co., Ltd.
16:05-16:30	To Be Determined	Core Ocean Technology (Shenzhen) Co., Ltd. (tentatively invited)
16:30:00	Conference Ends

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