10月19日(周四) | |
7:30am - 8:30am | 登记与交流 |
8:30am - 9:15am | 开幕式主题演讲 |
Morning Session | SiP组装技术的创新 |
9:15am - 9:45am | ASM解决方案在SiP中的应用 |
9:45am - 10:15am | 移动终端的SiP技术创新趋势 |
10:15am - 11:00am | 茶歇与展示 |
11:00am - 11:30am | 诺信SIP的创新整体解决方案 |
11:30am - 12:00am | 系统级封装及小型化模组解决方案 |
12:00pm - 13:30pm | 午餐与展示 |
Afternoon Session | SiP设计和系统集成 |
13:30pm - 14:00pm | 先进的SIP技术和系统设计 |
14:00pm - 14:30pm | 高速倒装系统级封装的设计与仿真分析 |
14:30pm - 15:00pm | 混合SiP封装总解决方案和批量生产 |
15:00pm - 15:30pm | 茶歇与展示 |
15:30pm - 16:00pm | 毫米波应用的SIP系统设计 |
16:00pm - 16:30pm | 异构集成趋势驱动SiP设计工具和流程的演进 |
16:30pm - 17:00pm | 具有电磁屏蔽的BGA SSD |
17:00pm - 17:30pm | 模块和SiP热管理 |
17:30pm - 19:00pm | 展示厅接待酒会 |
10月20日(周五) | |
7:30am - 8:30am | 登记与交流 |
Morning Session | 先进的SIP材料和互连技术 |
8:30am - 9:00am | SiP设计挑战之材料解决方案 |
9:00am - 9:30am | “All in one Package”未来封装解决方案 |
9:30am - 10:00am | 新一代智能器件的先进材料和互连技术 |
10:00am - 10:30am | 茶歇与展示 |
10:30am - 11:00am | SiP封装互连材料 |
11:00am - 11:30am | SiP基板技术平台和趋势 |
11:30am - 12:00am | 应用于智能SIP领域的先进封装材料和技术 |
12:00pm - 13:30pm | 午餐与展示 |
Afternoon Session | SiP测试和测试开发解决方案 |
13:30pm - 14:00pm | 采用平台化策略优化SiP测试成本 |
14:00pm - 14:30pm | SiIP模块测试的整体解决方案 |
14:30pm - 15:00pm | SiP 产品连板测试夹具的创新 |
15:00pm - 15:30pm | 茶歇与展示 |
Afternoon Session II | 先进技术 |
15:30pm - 16:00pm | 先进封装技术的发展趋势,挑战和解决方案 |
16:00pm - 16:30pm | SiP模块测试的整体解决方案 |