Advancements in System-in-Package (SiP) packaging landscape during the past few years have brought many new solutions and techniques along with sophisticated system integration methodologies for better electrical, mechanical and thermal performances. The advancement in SiP assembly, test and material forms the heart and soul of the new generation of SiP platforms.

This conference and the exhibition will highlight new advancement in SiP technologies that are helping to implement size reduced and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of application such as 5G-NR cellular, IoT, autonomous vehicles, Artificial Intelligent (AI), data storage, computing and networking.

SiP Conference China 2021 will feature two days of keynote speeches and technical presenters covering SiP technology and business trends from OSATs, test providers, material suppliers, system houses, research and development industries. Given the current global COVID-19 consideration, a few of the keynotes and the presentations will be conducted virtually either through live or recorded Webinars

The SiP Conference China is widely regarded as the most prominent SiP conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.

On behalf of the Program Committee and Executive Committee, it is my pleasure to invite you to the 5th annual SiP China Conference, which will be held in Shenzhen International Exhibition Center (Baoan, Shenzhen, China) from September 2-3, 2021.

Additionally, the conference will offer attendees numerous opportunities for networking and discussion with colleagues during coffee breaks, daily luncheons and nightly receptions.

We look forward to having you join us in September for this important event.

Nozad Karim

General Chair of SiP Conference China 2021

VP. Amkor Technology









The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

SiP Technology Development and Challenges

The Opportunity of SiP Chip Under 5G Trend

SiP: For Application

SiP Design Process and Material Solutions

SiP Package Test and Equipment Selection



Nozad Karim
 VP, SiP
Product Line
 Amkor Technology

Rozalia Beica
CSO Mobile Applications and
Semiconductor Division Business Unit
Mobile Devices and Substrates AT & S

David Lu
Former VP, New Technology
Research Institute vivo Mobile
Communication Co., Ltd.

Feng Ling
Founder and CEO,
Co., Ltd.

Ramachandran K. Trichur
Henkel Adhesive Technologies
– ElectronicsGlobal head of
Advanced Semiconductor
Packaging Market Segment

Farhang Yazdani
BroadPak Corporation
President & CEO

More →

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