From 2017 to 2021, the SiP Conference China attracted more than 200 international and regional companies from China, the United States, France, Germany, Italy, the Netherlands, Japan, South Korea, India, Malaysia, Singapore, etc. The participation of enterprises has truly realized the construction from SiP China to SiP World, realizing the exchange of cutting-edge technology. After years of industry experience, the Sixth SiP China Conference will continue to set up two sub-venues in 2022, aiming to fully radiate the SiP packaging industry clusters in the Yangtze River Delta and the Pearl River Delta. What's more, it will meet the needs of the booming 5G, AIoT industry chain, and smart wearables, smart phones, smart cars, data centers and other product lines.

√ Authority: Focus on global system-level packaging technology, bringing together leading companies in global packaging and testing fields.

√ Cutting-edge: Include excellent electronic system design, packaging expertise and all aspects of the advanced packaging design chain

√ Focus: Bring together OSAT, EMS, OEM, IDM, fabless semiconductor design companies and silicon wafer foundries, as well as raw material and equipment assembly and testing suppliers

The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

● New Development of SiP and Advanced Packaging Technology

● SiP assembly and test equipment

● SiP technology applications and solutions

● SiP packaging process and material scheme

● SiP system design and automation


Conference Chairs:

Russell Liu

China Wafer Level CSP Co., Ltd.

It's been almost 60 years since “Moore's Law” paper was published in 1965. So far, great changes have taken place in technology, industry and market. At present, the expectation of packaging technology in the post-Moore era has also become an industry consensus. With the development of SiP changing with each passing day, the release of the HIR roadmap in 2016 and the establishment of the UCIe standardization alliance in 2022 indicate that the industry will continue to reach a new level of technology. I hope SiP Conference 2022 can inherit the tradition of SiP conferences for many years, and continue to be professional and focused in this year's conference to bring more exciting shares about the cutting-edge development trends of SiP advanced packaging and the ecological development status of domestic and foreign industrial chains. Wish the conference successfully held!

Suny Li

SiP Tech Specialist

Sun Yizhong

Guanglu New Energy Technology (Jiangsu) Co. Ltd
Deputy general manager

With the rapid development of a new generation of information technology, the Internet of Things, smart phones, data centers, new energy and other application fields have always been making great progress together, driving the advancement of semiconductor technology, such as chip packaging technology from single-chip to multi-chip integration. In the past 20 years, multi-chip packaging technology has developed from RF modules, 2.5D ICs, high-density RDL/FOWLP, and 3D-ICs to heterogeneous integration based on chiplets, aiming to pursue lower costs, achieve more functions, and tap greater potential under existing wafer manufacturing capabilities.

At the beginning of 2016, Zhongmou Zhang, chairman of TSMC, proposed that SiP advanced packaging is an important way to practice Moore's Law. This viewpoint is still essential in 2022 when profound changes have taken place in global politics, economy and industry. With the requirements of product applications and the evolution of manufacturing technology, the concept of SiP and the traditional surface mount practice as a first step, integrates more advanced packaging technologies, and requires more close collaboration between design and engineering, equipment and materials.

The SiP Conference China has been held for five consecutive years, and it has gradually become a leading event for the domestic SiP industry. At the Suzhou station in 2022, we plan to invite outstanding companies in the SiP and advanced packaging fields to demo their latest technological innovations and application practices in different links of the industry chain, such as 3D-IC, Chiplet, etc. We also hope more and more domestic emerging enterprises can come here to share the most cutting-edge technology, so as to jointly promote the comprehensive development of domestic industries. In May 2022, I look forward to meeting you as usual!


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