General Chair’s Welcoming Statement of SiP 2021

On behalf of the Organizing Committee, I am honored to invite you to SiP Conference China 2021, which will be held in Shanghai, China on May 21, 2021.

With the commercialization of 5G communication and artificial intelligence technology, System in Package(SiP) has ushered in a high-speed period for the development of industry due to its advantages of high performance, low power consumption and miniaturization. We have seen a lot of progress in SiP design, EDA, package testing and equipment materials. A variety of new solutions and advanced system integration methods have emerged in smartphones, the Internet of Things, wearable devices, data center, high-performance computing, automotive electronics and other terminal applications.

SiP Conference China is the most influential conference in the SiP industry in China. At this year's conference, we will provide you with a whole day of keynote speeches and technical speeches, covering the latest SiP technologies, market trends, best application cases and solutions from the whole industry chain of SiP, such as system companies, IC design companies, EDA companies, OSAT companies, equipment materials companies, etc.

Meanwhile, we also create a platform for communication and cooperation among peers from all aspects of the whole industry chain of System in Package. You can communicate fully and explore cooperation with industry experts in technology, market, application and other fields during the interval of the speech and the lunch.

We are looking forward to meeting you at SiP Conference China 2021 on May 21!

Feng Ling

Chairman of SiP Conference China 2021

Founder and CEO of Xpeedic co., LTD








Webinar Attendees

The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

SiP Business Market Progress and Technology

SiP Package Techology Innovation

SiP Materials and Equipment


General Chair: Feng LingFounder and CEO, Xpeedic Technology

Feng Ling is currently Founder and CEO of Xpeedic, a leading EDA software provider. Dr. Ling has over 20 years of industry experience in EDA, RF front end, and system-in-package spanning from Motorola, Neolinear, Cadence, Physware, to Xpeedic. Dr. Ling received his Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign (UIUC) in 2000. He is a Senior Member of IEEE. He has authored and co-authored 3 book chapters and more than 60 papers in refereed journals and conference proceedings.

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SIP China Shanghai Station Agenda

Time: May 21,2021
Venue: Renaissance Shanghai Caohejing Hotel, China


Conference Room

9:00am - 9:30am

Registration and Networking

Session 1

SiP market update and frontier technology
General Chair:Feng Ling, Founder and CEO, Xpeedic Co.,LTD

9:30am - 10:00am

SiP Technology Trends and Challenges for EDA Industry

Feng Ling, Founder and CEO, Xpeedic Co.,LTD

10:00am - 10:30am

SiP Technology Application in Product Design of Wingtech

Zhu Huawei, President and Vice President of Wingtech Research Institute, Wingtech Technology

10:30am - 11:00am

Advanced Packaging Technologies Promote MEMS Innovation

Carlos Zhao, Senior Integration Manager for MEMS, Will Semiconductor Co., Ltd. Shanghai

11:00am - 11:30am

USI&ASE SiP Technology Roadmap

Mike Zhao, AVP of SiP RD Center & Syste in Module BU, Universal Scientific Industrial (Shanghai) Co., Ltd.

11:30am - 12:00pm

Enabling SiP Technologies & Applications in Smart Terminals

Rico Tian, Senior Director, Goertek Microelectronics Co. Ltd.

12:00pm - 12:30pm

Advanced Packaging Enabler for Highly Effective SiP and Heterogeneous Integration

Jing Zhang, Head of Shanghai Innovation Center, Heraeus Electroncis China, Heraeus Materials Technology Shanghai Ltd

12:30pm - 01:30pm

Lunch Break & SiP Zone


Conference Room (A)

Session 2

Innovation in SiP assembly Technology
Session Leader: Dr. Weiping Li, Guest Research Fellow, Shanghai Institute of Science and Technology Achievements Evaluation

01:30pm - 02:00pm

2.5D/3D system-in-package design and simulation process

Hui Wang, AE Director, Cadence Design Systems Inc.

02:00pm - 02:30pm

5G Cellular RF Front-end Module Design and Package Trend

Gu Jianzhong, COO, XinpleTek (Shanghai) Co., Ltd

02:30pm - 03:00pm

Problems and Challenges of AI/GPU Products in the Collaborative Design of Chips, Substrates and Systems

Daniel Wen, R&D Director & Alchip Wuxi site GM,Alchip Technologies, Limited

03:00pm - 03:15pm

Coffee Break & Exhibit

03:15pm - 03:45pm

Are you ready for catch up the diversity of SiP design tool?

Hongrun Li, Chief Representative, ZUKEN Inc.

03:45pm - 04:15pm

From Building up Data-Driven Smart Manufacturing to Leveraging Test Data for Whole Product Life Cycle Acceleration

Min Tang, Principal Offering Manager, NI

04:15pm - 04:45pm

Development of SiP technology for RF module

Daquan,Yu, GM, Sky Semiconductor

04:45pm - 05:00pm



Conference Room (B)

Session 3

SiP Material & Equipment
Session Leader: Russell Liu, VP, China Wafer Level CSP Co., Ltd.

01:30pm - 02:00pm

Advanced Placement Capability for Future SiP Production

Ji Xu, SMT Solutions Product Marketing Manager, ASM Assembly Systems Ltd.

02:00pm - 02:30pm

Technical Challenges of SiP Packaging Equipment

Jonathan Li, CTO, GuiLin LDZX Electronics Technology Co., Ltd.

02:30pm - 03:00pm

Weldtone adhesive material solutions in SiP

Seven Lang, BD Manager, Xiamen Weldtone Technology Co.,Ltd.

03:00pm - 03:15pm

Coffee Break & Exhibit

03:15pm - 03:45pm

Material Challenges and Solutions for System-in-Package (SiP) Applications

Danhui Gu, Henkel, Henkel AEE China Semiconductor TCS manager

03:45pm - 04:15pm

Fine Feature Solder Printing for SIP

Leo Hu, Semiconductor Technical manager, Indium Corporation

04:15pm - 04:45pm

Enabling Heterogeneous Integration through Advanced Substrate

Rozalia Beica, Head of Semiconductor Business Line, AT&S (China) Co., Ltd.

04:45pm - 05:00pm