As one of the global significant SIP events, SiP China has attracted over 200 enterprises from China, the United States, France, Germany, Italy, the Netherlands, Japan, South Korea, India, Singapore, Malaysia and other countries and regions to participate during 2017 to 2021, fully promoting the interaction and development of IC design, packaging, 5G, AI industrial chain, truly realizing the construction from SiP China to SiP World, and the integration from cutting-edge technology exchange to high-end circles.

After years of industry development, the 6th SiP China will continue to set up two venues: aiming to fully radiate the SiP packaging industry cluster in the Yangtze River Delta and Pearl River Delta regions, to meet the needs of the booming 5G and AloT industry chains, as well as the demands of product lines such as smart wearables, smartphones, smart cars, and data centers. From September 15 to 17 of the same year, "from Smart Design to Advanced Packaging and Testing, the Electronics, Packaging and Testing Embedded exhibition" - the ELEXCON Shenzhen International Electronics Exhibition and Embedded Systems Exhibition and the 6th SiP China and Exhibition will continue to set sail in Shenzhen Convention and Exhibition Center (Futian). A quick glance at the new "Blue Ocean" in 5 areas: booths for automotive-grades and energy storage, power supply and carbon neutralization, embedded and AIoT, SiP and advanced packaging and testing, domestic substitution, and localized supply chain;

√ Authority: gathering premium SiP and advanced packaging and testing experts, think tanks and industrial chain resources around the world

√ Focus: fully focus on new technologies, market trends and application cases in the system-level packaging and advanced packaging and testing

√ Integration: integrate industrial chain resources, from wafer manufacturing, IC packaging and testing to terminal manufacturing, and promote industrial chain integration and innovation

The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

● SiP Assembly & Test

● SiP Heterogeneous Integration

● Advanced in SiP Material and Interconnect Technology

● SiP Test & Design Solutions

● Advancement in SiP Substrate

● SiP Assembly Equipment



Nozad Karim

General Chair of SiP Conference China 2022
VP. Amkor Technology

The advanced SiP packaging will see greater package innovative solutions in electrical, mechanical, and thermal performances and system integrations. The advancement in SiP assembly, test, material, and adoption of heterogeneous integration with chiplets forms the heart and soul of the new generation of SiP platforms.

The conference and the exhibitions will highlight new advancement in SiP technologies to implement package miniaturization and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of application such as 5G-NR cellular, IoT, autonomous vehicles, Artificial Intelligent (AI), data storage, computing and networking.

SiP Conference China 2022 will feature two days of keynote speeches and technical presenters covering SiP technology and business trends from OSATs, test providers, material suppliers, system houses, research and development industries. Given the current global COVID-19 consideration, a few of the keynotes and the presentations will be conducted virtually either through live or recorded Webinars

The SiP Conference China is widely regarded as the most prominent SiP conference in China will be co-located with ELEXCON 2022. The conference will offer attendees numerous opportunities for networking and discussion with colleagues during daily luncheons.

On behalf of the Program Committee and Executive Committee, it is my pleasure to invite you to the 6th annual SiP China Conference. We look forward to having you join us for this important event.

Feng Ling

CEO Xpeedic

Feng Ling is currently Founder and CEO of Xpeedic, a leading EDA software provider. Dr. Ling has over 20 years of industry experience in EDA, RF front end, and system-in-package spanning from Motorola, Neolinear, Cadence, Physware, to Xpeedic. Dr. Ling received his Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign (UIUC) in 2000. He is a Senior Member of IEEE. He has authored and co-authored 3 book chapters and more than 60 papers in refereed journals and conference proceedings.

Rozalia Beica

VP Strategic Marketing
Business Development

Rozalia Beica is currently leading the Semiconductor Business Line within AT&S. Prior to AT&S she had several executive roles with various organizations across the supply chain: electronic materials (Rohm and Haas Electronic Materials, Dow & DuPont), equipment (Semitool, Applied Materials and Lam Research), device manufacturing (Maxim IC) and market research & strategy consulting firm (Yole Developpement). Rozalia is actively involved in various industry activities, recently awarded with the IMAPS 2020 Leadership Award. Current engagements include: Member of the Board of Governors for IEEE Electronics Packaging Society and Vice General Chair of 71th ECTC, Chair of the Heterogeneous Integration Roadmap WLP Technical Working Group, Executive Chair of System in Package China Symposium, Advisory Board Member 3DinCites and IMPACT Taiwan. Past activities: IMAPS VP of Technology, General Chair IMAPS DPC, Program Director EMC3D Consortia, General Chair Global Semi & Electronics Forum, Technical Advisory Board Member SRC, several other memberships in industry committees. Rozalia has over 150 presentations & publications, including 3 book chapters on 3D Integration. Rozalia has a M.Sc in Chemical Engineering (Romania), a M. Sc. in Management of Technology (USA) and a Global Executive MBA from IE Business School (Spain) in partnership with Fudan University (China), Brown University (USA) and Insper University (Brazil).

'section--purple wow fadeInDown'; this.parentNode.insertBefore(section, this); };